High resolution supports 5MP 2/3″ camera
Adopt double telecentric (object side, image side) design
Proprietary identification of features such as integrated circuits, glass, LCD panels, etc.
Efor automated high speed operations
Parameters
| EFL | None- coaxial Illumination | Sensor size | 2/3″ |
| Magnification（x） | 1.5x | MOD | 65 |
| F.NO | 12 | Numerical aperture | 0.063 |
| Telecentric degree | <0.1° | TV Distortion | ﹤0.1% |
| Depth of field | 0.240 | Object Resolution | 5.33um |
| TTL | 87.35 | Mount | C-Mount |
| 2/3″FOV(D×H×V) | 7.3×5.8×4.4 | Magnification | 1.5 |
| WD | 65mm |
Fixed aperture, various aperture available
Supports 1/1.7″ , 2/3 “and 1.1″ chips respectively
Suitable for high vibration and high impact
environment such as robot arms
Support 1.4″ sensor, compatible with 4/3″, 1.1″ sensor
Optical structure optimization for large size chip, with standard C-mount
Excellent performance at any working distance
Large image circle, suitable for IMX253LLR(1.1’’ 12MP)
EFL range from 16mm to 75mm
Magnification range from 0.03×-0.8×
Ultra-low distortion(<0.05%)
High contrast, low distortion
Ultra high imaging quality
Matches the IMX226 sensor
Series focal length covers 6-50mm
Compact, super compact design
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