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Project Details

Chips Inspection System

The ET XPro Vision system can be used to inspect post-diced wafer chips as well as the Packets after packing. This helps manufacturers provide a quality product to its consumer. Inspection of the product also helps manufacturers reduces the downtime and ensures uniformity of the product delivered. The ET XPro uses advanced illumination systems and High-Speed Line cameras to ensure the products are inspected seamlessly without any reduction in the throughput.

List of Defects

  • Sealing of the Packets
  • Over Fried / Under Fried Chips
  • Broken Chips can be identified
  • Absence of the Barcode
  • Absence of MRP and Date of Manufacture